(From Left, Clockwise) Transparent Display with CIT’s Technology, Glass Substrate (Glass TGV), Ultra-Thin Copper Film | Photo by CIT
Korean advanced materials startup CIT (CEO Seung Jeong) is gaining attention at MWC 2025 in Barcelona, Spain, by unveiling groundbreaking innovations in ultra-smooth copper plating on semiconductor glass substrates. CIT has successfully developed ultra-thin using its proprietary Atomic Sputtering Epitaxy (ASE) technology. These ultra-flat circuits enable transparent antennas and displays while advancing copper plating for next-generation semiconductor glass substrates.
At MWC 2025, CIT showcases its ASE-based technologies, including the Dolphin transparent antenna, ultra-flat copper plating, and transparent displays.
The Dolphin Transparent Antenna, which won the CES 2025 Innovation Award Honoree in the Vehicle Tech & Advanced Mobility category, is 1,000 times thinner than conventional vehicle antenna circuits while improving signal reception by 20%. The MWC version of Dolphin integrates an "Etalon" structure, enhancing heat and weather resistance for outdoor applications. Its oxidation resistance temperature has increased from 200°C to 467°C, and it maintains its mechanical properties even after 1,000 bending cycles at 150°C. This durability makes it suitable for curved or stretchable surfaces. Additionally, Dolphin utilizes recycled waste conductors, reducing its carbon footprint by 95% compared to conventional manufacturing methods.
CIT has also unveiled a copper plating sample for semiconductor glass substrates, achieving an unprecedented smoothness of less than 4nm—200 times smoother than conventional HVLP 4-grade copper foils (with a roughness of <800nm). CIT’s copper plating method eliminates at least two process steps from traditional electroless and electroplating techniques, significantly enhancing efficiency. Moreover, the direct copper plating on glass substrates (without a seed layer) supports TGV (Through Glass Via) structures with a 6:1 aspect ratio, marking a major technological breakthrough.
The transparent display employs ultra-thin copper circuitry, making the circuits invisible to the human eye. This technology is expected to be widely adopted in exhibitions, industrial facilities, and public transportation. CIT has achieved 30-40% transparency and aims to increase transparency to 50-60% in future iterations.
As the AI semiconductor era accelerates, glass substrates emerge as the next-generation PCB material due to their superior signal transmission and power efficiency. CIT’s breakthrough in nano-scale circuit fabrication positions it as a key player in this transformation. Its ASE plating technology was published in Nature Communications (February 2025) and has received international recognition, including the CES 2025 Innovation Award and Gadgety Award.
(From Left) Standard Antenna and Low-Dielectric 5G Antenna Using CIT’s Technology | Photo by CIT
CEO Seung Jeong stated, “Copper is fundamental in nearly every industry. We aim to deeply understand industry needs and provide the highest-quality materials to meet these demands.” CIT’s glass-based ultra-flat copper plating and other advanced materials technologies are expected to drive innovation in telecommunications, semiconductors, and beyond.
Founded in 2023, CIT has rapidly emerged as a leader in next-generation electronic substrate materials. It develops low-dielectric FCCL (Flexible copper-clad laminate), transparent antennas, transparent displays, and ultra-fine glass substrate circuitry. Its solutions serve industries such as telecommunications, semiconductors, automotive, smart buildings, and AR/VR.
In addition to being the CES Innovation Award Honoree, CIT won the CES 2025 Gadgety Award. Last year, it also won the FLY ASIA Advanced Manufacturing Award, the Public Technology Commercialization Innovation Award, and the Korean Ministry of Science and ICT Excellence Award.
Beyond technology, CIT emphasizes sustainability. Recycled conductor-based eco-friendly manufacturing reduces carbon emissions to 1/1000 of traditional methods. The company collaborates with global corporations to accelerate commercialization, solidifying its position as a worldwide leader in next-generation electronic substrate materials.
DK Kim Reporter davis@aving.net
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CIT Showcases Innovative Semiconductor Glass Substrate Copper Plating Technology at MWC 2025: Transparent Antennas, Displays, and Ultra-Smooth Copper Circuitry
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Facebook(으)로 기사보내기Twitter(으)로 기사보내기Copy url(으)로 기사보내기바로가기Korean advanced materials startup CIT (CEO Seung Jeong) is gaining attention at MWC 2025 in Barcelona, Spain, by unveiling groundbreaking innovations in ultra-smooth copper plating on semiconductor glass substrates. CIT has successfully developed ultra-thin using its proprietary Atomic Sputtering Epitaxy (ASE) technology. These ultra-flat circuits enable transparent antennas and displays while advancing copper plating for next-generation semiconductor glass substrates.
At MWC 2025, CIT showcases its ASE-based technologies, including the Dolphin transparent antenna, ultra-flat copper plating, and transparent displays.
The Dolphin Transparent Antenna, which won the CES 2025 Innovation Award Honoree in the Vehicle Tech & Advanced Mobility category, is 1,000 times thinner than conventional vehicle antenna circuits while improving signal reception by 20%. The MWC version of Dolphin integrates an "Etalon" structure, enhancing heat and weather resistance for outdoor applications. Its oxidation resistance temperature has increased from 200°C to 467°C, and it maintains its mechanical properties even after 1,000 bending cycles at 150°C. This durability makes it suitable for curved or stretchable surfaces. Additionally, Dolphin utilizes recycled waste conductors, reducing its carbon footprint by 95% compared to conventional manufacturing methods.
CIT has also unveiled a copper plating sample for semiconductor glass substrates, achieving an unprecedented smoothness of less than 4nm—200 times smoother than conventional HVLP 4-grade copper foils (with a roughness of <800nm). CIT’s copper plating method eliminates at least two process steps from traditional electroless and electroplating techniques, significantly enhancing efficiency. Moreover, the direct copper plating on glass substrates (without a seed layer) supports TGV (Through Glass Via) structures with a 6:1 aspect ratio, marking a major technological breakthrough.
The transparent display employs ultra-thin copper circuitry, making the circuits invisible to the human eye. This technology is expected to be widely adopted in exhibitions, industrial facilities, and public transportation. CIT has achieved 30-40% transparency and aims to increase transparency to 50-60% in future iterations.
As the AI semiconductor era accelerates, glass substrates emerge as the next-generation PCB material due to their superior signal transmission and power efficiency. CIT’s breakthrough in nano-scale circuit fabrication positions it as a key player in this transformation. Its ASE plating technology was published in Nature Communications (February 2025) and has received international recognition, including the CES 2025 Innovation Award and Gadgety Award.
CEO Seung Jeong stated, “Copper is fundamental in nearly every industry. We aim to deeply understand industry needs and provide the highest-quality materials to meet these demands.” CIT’s glass-based ultra-flat copper plating and other advanced materials technologies are expected to drive innovation in telecommunications, semiconductors, and beyond.
Founded in 2023, CIT has rapidly emerged as a leader in next-generation electronic substrate materials. It develops low-dielectric FCCL (Flexible copper-clad laminate), transparent antennas, transparent displays, and ultra-fine glass substrate circuitry. Its solutions serve industries such as telecommunications, semiconductors, automotive, smart buildings, and AR/VR.
In addition to being the CES Innovation Award Honoree, CIT won the CES 2025 Gadgety Award. Last year, it also won the FLY ASIA Advanced Manufacturing Award, the Public Technology Commercialization Innovation Award, and the Korean Ministry of Science and ICT Excellence Award.
Beyond technology, CIT emphasizes sustainability. Recycled conductor-based eco-friendly manufacturing reduces carbon emissions to 1/1000 of traditional methods. The company collaborates with global corporations to accelerate commercialization, solidifying its position as a worldwide leader in next-generation electronic substrate materials.