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BDMT GLOBAL RELEASES TOP 40 GLOBAL INNOVATIONS REPORT WITH CUTTING-EDGE SOLUTIONS FOR U.S. NEEDS ACROSS INDUSTRIES
Prelude to Innovator Summit: A Unique Business Development Opportunity Activating Multiple Verticals...
2026-07-01
CIT Showcases Ultra-Flat Copper Technology, Two-Time CES Innovation Award Winner, at CES 2026(FOX, NBC,CBS NEWS)
Original News Article(FOX)Original News Article(NBC NEWS)Original News Article(CBS)CIT Targets Globa...
2026-03-03
CIT Showcases Ultra-Flat Copper Technology, Two-Time CES Innovation Award Winner, at CES 2026(AP NEWS)
Original News ArticlePublished 4:46 PM GMT+9, January 20, 2026CIT Targets Global AI Semiconductor Ma...
2026-03-03
CIT's New 'CuFlat-PKGCore' Tech Boosts Speed and Efficiency for Next-Gen Semiconductor Packaging.
Original News Article CIT has introduced the CuFlat-PKGCore, a key material solution forsemiconducto...
2025-09-12
This tiny company just solved AI’s biggest problem
Original News ArticleThis tiny company just solved AI’s biggest problemUltra-smooth copper sur...
2025-08-14
CIT Showcases Innovative Semiconductor Glass Substrate Copper Plating Technology at MWC 2025: Transparent Antennas, Displays, and Ultra-Smooth Copper Circuitry
Article source기자명DK Kim Reporter Tech & Bio Published 2025.03.03 04:17CIT Showcases Innovative S...
2025-03-06
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BDMT GLOBAL RELEASES TOP 40 GLOBAL INNOVATIONS REPORT WITH CUTTING-EDGE SOLUTIONS FOR U.S. NEEDS ACROSS INDUSTRIES
Prelude to Innovator Summit: A Unique Business Development Opportunity Activating Multiple Verticals...
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2026-07-01
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CIT Showcases Ultra-Flat Copper Technology, Two-Time CES Innovation Award Winner, at CES 2026(FOX, NBC,CBS NEWS)
Original News Article(FOX)Original News Article(NBC NEWS)Original News Article(CBS)CIT Targets Globa...
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2026-03-03
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555
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CIT Showcases Ultra-Flat Copper Technology, Two-Time CES Innovation Award Winner, at CES 2026(AP NEWS)
Original News ArticlePublished 4:46 PM GMT+9, January 20, 2026CIT Targets Global AI Semiconductor Ma...
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2026-03-03
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CIT's New 'CuFlat-PKGCore' Tech Boosts Speed and Efficiency for Next-Gen Semiconductor Packaging.
Original News Article CIT has introduced the CuFlat-PKGCore, a key material solution forsemiconducto...
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2025-09-12
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This tiny company just solved AI’s biggest problem
Original News ArticleThis tiny company just solved AI’s biggest problemUltra-smooth copper sur...
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2025-08-14
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CIT Showcases Innovative Semiconductor Glass Substrate Copper Plating Technology at MWC 2025: Transparent Antennas, Displays, and Ultra-Smooth Copper Circuitry
Article source기자명DK Kim Reporter Tech & Bio Published 2025.03.03 04:17CIT Showcases Innovative S...
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2025-03-06
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CIT wins Gadgety Award
Original news articleTransform your Gadgety Award into tangible marketing momentum.Congratulations t...
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2025-01-23
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1087
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Antenne transparente en cuivre : l’innovation de CIT qui révolutionne la connectivité – Interview CES 2025
Original News ArticleAntenne transparente en cuivre : l’innovation de CIT qui révolutio...
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2025-01-09
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Global Media Coverage for CIT Winning CES 2025 Innovation Award
Outlet NameLocationSource TypeIndustryPotential AudienceAP NEWS [The Associated Press]GlobalNews &am...
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2024-12-31
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Firm Plans to Revolutionize 5G with Recycled, Flexible Copper Antenna Tech
Original news articleby Ana Trandafir24 days agoCIT's flexible copper material can be used in fl...
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2024-09-15
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